CHIMEI launches high heat resistant PC alloy for 5G product applications
With the advent of the 5G era, demand for higher product performance continues to increase, such as more flame retardant and heat resistant materials for communications applications.
In response to this increased demand, CHIMEI has developed PC 545, featuring truly high flame retardant and high heat resistant properties with great processability.
Chi Mei launch new high flow high impact ABS
Chi Mei the world’s largest producer of ABS have recently launched a new grade of ABS PA757H. It demonstrates a 30% increase in MFR compared to standard PA757 and a 20% increase in impact strength.
